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  • Materials
    • DBC Substrates
    • AMB Substrates
    • DAB Substrates
    • DPC Substrates
    • Ceramic Substrates
    • AlON Coating
    • CuMoCu Heatsink
    • Sinter Materials
    • Microchannel Cooler
    • S-DBC Substrates
    • High Power MLCC
  • Innovations
    • Flying Leaded Substrates
  • Competence
    • Thermal
    • Chemical
    • Patterning
    • Laser Processing
    • R&D / Engineering
    • Metal Processing
  • News
  • Company
    • Downloads
  • Partner
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Author Archives: vschuller

New Product Introduction – Next Generation ZTA-DBC Substrates

UncategorizedBy vschuller6. February 2026

At Global BA GmbH, we are excited to introduce a major reliability milestone in power electronics substrate technology. We are the first supplier able to provide ZTA-DBC substrates achieving thermal cycling reliability up to 1,000 cycles (1) under demanding conditions of -55°C to +150°C. Conventional ZTA-DCB solutions typically show failure mechanisms after approximately 200 cycles,…

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IPT. Corp

By vschuller20. April 2023

Solution provider for the semiconductor industry: Soldering, sintering, automation and assembly

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MFis

By vschuller19. April 2023

Multiphysics Engineering CAD Software for Wirebonding

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Bond IQ

By vschuller19. April 2023

Process consulting for wirebonding

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Bond Pulse

By vschuller19. April 2023

Process consulting for silver sintering and vacuum soldering

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Thermal Systems

By vschuller19. April 2023

Manufacturer of soldering and special equipment for the semiconductor industry

PCIM EUROPE 2023

UncategorizedBy vschuller19. April 2023

WE ARE EXHIBITING AT THE PCIM EUROPE 2023 9. – 11. MAY 2023, NUREMBERG, GERMANY Hall 7 / Booth 114

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