We developed insulated circuit board used in IGBT (Insulated Gate Bipolar Transister) , which is used as a high power frequency conversion device such as a hybrid car, a fuel cell car, an electric vehicle, a Shinkansen, CS-DBC). In recent years, when SiC replaced Si for semiconductor, SiN for insulating ceramics, and 1mm thick copper for circuit are used. We offer ceramic/copper joints by diffusion bonding.
Features of our products
- Improvement of thermal conductivity by absence of bonding layer
- Strong adhesion
- New construction method by proprietary development (S-DBC)
- correspond to SiN · AlN · Al2O3
S-DBC method (Developed by FJ Composite)
S-DBC：Sputtering Diffusion Bonding Copper
Conventional method
S-DBC method
Diffusion Bonding
Joining strength evaluation of thermal diffusion bonding
(user evaluation result)
| AMB (other company’s product) | 98 N/4mm² |
| S-DBC (FJ Composite) | 106 N/4mm² (destruction of ceramic base material) |
Before testing (Cu / SiN / Cu specimen)
After testing (bond strength> ceramic strength)
Heat cycle test
① High temperature operation Reliability test (-45 to 150 ° C / cycle, dwell time 20 min, @ each Temp)
-45 ~ 150 ° / 2000 times Test passed (User evaluation)
② Observation result of DBC circuit board bonding state
-40 to 250 ° / 3000 times Test passed (AIST evaluation result)
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