Al2O3 Substrates
- Good smoothness / flatness with less porosity
- Excellent in adhesion with thin film and thick film materials
- Less variance in outline, plate thickness, slit pitch, etc.
- Minimal warpage, bending, and undulation
- Physical and chemical properties are stable even under a hot environment. Excellent in thermal shock resistance
- High thermal conductivity and coefficient of thermal expansion similar to that of silicon
- Excellent resistance against oil and chemical
- Excellent in insulation properties, high dielectric breakdown voltage, high surface resistivity / volume resistivity, and smalldielectric constant
- Stable breaking strength, and less variance in shape or dimensions.
- The high reflective substrate, especially suitable for optical applications such as LED, is also available
ZrO2 Substrates
- Well controlled surface roughness with homogeneous and fine microstructure
- 50% higher bending strength than Alumina or AlN substrates
- 20% higher thermal conductivity than alumina substrates
- The optical reflectivity is higher than alumina substrates. The substrate with higher reflectivity is also available
- Higher electrical insulation and smaller dielectric constant than alumina substrates
AIN Substrates
- Up to 10 times greater thermal conductivity than Alumina (170-250W/mK)
- Thermal expansion coefficient similar to silicon (Si)
- Smaller dielectric constant and higher electric insulation
- Stronger mechanical strength up to 600MPa
- Superior corrosion resistance
Silicon Nitride Substrates (Si3N4)
- Bending strength is about twice as high as that of aluminum nitride (AlN) and alumina
- Three times higher thermal conductivity than Alumina and ZTA substrates
- High dielectric breakdown voltage, high surface resistivity, high volume resistivity, excellent insulation properties
- Thermal Expansion Coefficient (CTE) close to silicon
Berryllium Oxide Substrates (BeO)
- Beryllium oxide substrate is the ideal material used in many high-performance semiconductor parts for applications such as radio equipment
- Beryllium oxide ceramic can insulate electronic devices electrically, and at the same time remove substantial quantities of heat from them to a chassis heat sink
- Some power semiconductor devices have used beryllium oxide ceramic between the silicon chip and the metal mounting base of the package in order to achieve a lower value of thermal resistance than for a similar construction made with alumina
- Beryllium oxide ceramic is also used as a structural ceramic for high-performance microwave devices, vacuum tubes, magnetrons, and gas lasers
