Ceramic Substrates

Al2O3 Substrates

  • Good smoothness / flatness with less porosity
  • Excellent in adhesion with thin film and thick film materials
  • Less variance in outline, plate thickness, slit pitch, etc.
  • Minimal warpage, bending, and undulation
  • Physical and chemical properties are stable even under a hot environment. Excellent in thermal shock resistance
  • High thermal conductivity and coefficient of thermal expansion similar to that of silicon
  • Excellent resistance against oil and chemical
  • Excellent in insulation properties, high dielectric breakdown voltage, high surface resistivity / volume resistivity, and smalldielectric constant
  • Stable breaking strength, and less variance in shape or dimensions.
  • The high reflective substrate, especially suitable for optical applications such as LED, is also available

ZrO2 Substrates

  • Well controlled surface roughness with homogeneous and fine microstructure
  • 50% higher bending strength than Alumina or AlN substrates
  • 20% higher thermal conductivity than alumina substrates
  • The optical reflectivity is higher than alumina substrates. The substrate with higher reflectivity is also available
  • Higher electrical insulation and smaller dielectric constant than alumina substrates

AIN Substrates

  • Up to 10 times greater thermal conductivity than Alumina (170-250W/mK)
  • Thermal expansion coefficient similar to silicon (Si)
  • Smaller dielectric constant and higher electric insulation
  • Stronger mechanical strength up to 600MPa
  • Superior corrosion resistance

Silicon Nitride Substrates (Si3N4)

  • Bending strength is about twice as high as that of aluminum nitride (AlN) and alumina
  • Three times higher thermal conductivity than Alumina and ZTA substrates
  • High dielectric breakdown voltage, high surface resistivity, high volume resistivity, excellent insulation properties
  • Thermal Expansion Coefficient (CTE) close to silicon

Berryllium Oxide Substrates (BeO)

  • Beryllium oxide substrate is the ideal material used in many high-performance semiconductor parts for applications such as radio equipment
  • Beryllium oxide ceramic can insulate electronic devices electrically, and at the same time remove substantial quantities of heat from them to a chassis heat sink
  • Some power semiconductor devices have used beryllium oxide ceramic between the silicon chip and the metal mounting base of the package in order to achieve a lower value of thermal resistance than for a similar construction made with alumina
  • Beryllium oxide ceramic is also used as a structural ceramic for high-performance microwave devices, vacuum tubes, magnetrons, and gas lasers