What if the heat sink was no longer a separate component?
With Direct Pin-Fin Bonding on AMB substrates, the cooling structure becomes part of the substrate itself – eliminating interfaces, reducing complexity, and significantly improving thermal performance.
Instead of the traditional stack (substrate → baseplate → TIM → heat sink), the copper pin-fin structure is directly bonded onto the ceramic. The result is a shorter thermal path and a much more efficient heat transfer.
Key advantages:
• No TIM required → eliminates one of the main thermal bottlenecks and aging risks
• Lower thermal resistance → faster heat dissipation, improved junction temperature
• Higher power density → enables more compact module designs
• Reduced weight & assembly effort → fewer parts, simplified system design
• Improved reliability → fewer interfaces, less risk of delamination or pump-ou
•Design flexibility → pin geometry can be optimized for flow and performance
In thermal simulations, the difference between sintering and brazing of the pin structure is negligible – the real benefit comes from the direct integration of the cooling structure itself.
For next-generation SiC and GaN applications, where every Kelvin matters, this approach opens up new possibilities for performance and system cost optimization.
If you’re currently working on high-power modules or looking to push thermal limits further, this is definitely worth a closer look.
