Direct Pin-Fin Bonding – Rethinking Thermal Design in Power Electronics
What if the heat sink was no longer a separate component? With Direct Pin-Fin Bonding on AMB substrates, the cooling…
Global BA GmbH is a Germany-based technology and sourcing partner specialized in advanced substrate technologies, semiconductor backend materials, and next-generation thermal management solutions for the global power electronics industry.
Founded and led by Dr. Christian Winkler, Global BA GmbH and his team supports leading Tier-1, Tier-2, OSAT, and semiconductor companies across Europe, Asia, and the United States with:
With more than 31 years of international industry experience and a strong network throughout Korea, China, Taiwan, Europe, and the US, Global BA acts as an interface between innovative material manufacturers and high-end semiconductor packaging customers worldwide.
What if the heat sink was no longer a separate component? With Direct Pin-Fin Bonding on AMB substrates, the cooling…
At Global BA GmbH, we are excited to introduce a major reliability milestone in power electronics substrate technology. We are…
STI has secured a USD 66.5M order from NTS China to build a highly automated, inline manufacturing line für high-performance…
WE ARE EXHIBITING AT THE PCIM EUROPE 2023 9. – 11. MAY 2023, NUREMBERG, GERMANY Hall 7 / Booth 114
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Global BA GmbH
Roentgenstr. 14
95478 Kemnath
Germany
Tel: +49 9642 5169489
Fax: +49 9642 5169490
Email: info(at)globalba.de
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