At Global BA GmbH, we are excited to introduce a major reliability milestone in power electronics substrate technology. We are the first supplier able to provide ZTA-DBC substrates achieving thermal cycling reliability up to 1,000 cycles (1) under demanding conditions of -55°C to +150°C. Conventional ZTA-DCB solutions typically show failure mechanisms after approximately 200 cycles,…
STI has secured a USD 66.5M order from NTS China to build a highly automated, inline manufacturing line für high-performance AMB (Active Metal Brazed) heat-spreader substrates, used in next-generation power semiconductor devices. The line includes STI´s latest inline TiAg/TiCu sputtering and brazing technology, enabling precision metallization with significantly improved thermal performance, reliability and process efficiency.…
WE ARE EXHIBITING AT THE PCIM EUROPE 2023 9. – 11. MAY 2023, NUREMBERG, GERMANY Hall 7 / Booth 114
A patented paste, CuB+, uses ceramic-copper composites as DCB hybrid technologies to provide enhanced electro-thermal and mechanical performance compared to standard DCB technology. By Christian Winkler and Munsoo Han, Consultants, Global BA GmbH DCB substrates with AMB performance – at DCB cost? CuB+ paste can be applied as a homogeneously-oxidized copper powder to all common…