Ag film for Power electronics

Ag film characteristics

Ag sintering film
Size (mm x mm) 100x100*
Thickness (µm) (±10%) 65
BLT** (µm) (±10%) 28
Ag contents (wt.%) > 98.0

* BLT: Bond Line Thickness after sintering

Roll

Sheet

  • High adhesion at low sintering pressure: 250°C, 10MPa, 120sec
  • Fast & easy film transfer (150°C, 2~3MPa, 0.5~3sec) / No burr issue
  • Min. fume during sintering

Competitor´s Film

AMO Film

Ag film transfer

Test conditions
: PET release film (release force 8~13g/inch)
: Rubber hardness (shore A 50)
: Film transfer conditions

pressure – 2.0 MPa Temp – 150℃ Time – 0.5sec

No burr after transfer

Sintering _ Ag deposited AMB substrate

  • Sintering temperature: 250°C
  • Sintering time: 120 sec
  • Chip surface finish: Au
  • Chip size: 5*5mm

Sintering _ Bare AMB substrate

  • Sintering conditions: 250/280°C, 180sec, in Air
  • Chip surface finish: Au
  • Chip size: 5*5mm