CuMoCu Heatsink

Physical Properties Table

Typical Properties Super - CMC Reference
Mo Content (%) Mo=5% Mo=10% Mo=20% Mo=40% Cu Mo
Thermal Conductivity (W / mK) Z-direction 362 335 291 230 394 137
XY-direction 381 369 344 290
Thermal Ex- pansion (x 10-6/°C RT - 250°C 14.8 11.8 7.4 6.6 17 5.2
RT - 400°C 13.5 9.3 6.8 6.2 18 5.6
RT - 800°C 9.5 7.5 6.5 6.1 19 5.7

MATERIAL CHARACTERISTICS OF S-CMC AND OTHER MATERIALS 

Our original „S-CMS® (Super CMC)“ is composed of multiple layers of Mo foil and Cu foil. Mo foil is eff ective more than Mo powder in order to control the CTE. As a result, S-CMC is high termal conductivity because of less Mo using. 

S-CMC Process Chart

  • Mo content (CTE) can be easily adjusted according to customer needs (low thermal expansion, high thermal conductivity) 
  • Diffusion bonding of various materials such as tungsten, diamond, AIN, aluminium and carbon are possible
  • A wide variety of plating is possible (Ni, Ag, Au, Au/Sn, Pt, etc.)

Conductive Spacer Design Rules

SPACER SPEC
Items Unit Value
Size mm 1m~200mm
Dimension mm ±0.05
Thickness mm ±0.0075
Fillet mm ≤ R0.1
Roughness μm ≤ Ra 1
Burr X,Y mm MAX 0.01
Z mm MAX 0.01
PLATING SPEC
Items Unit Value
Electro Plating Non-Electro Plating
Specifications 1st (Ni) μm 1~3
2st (ag) μm 1~3
* Other plating is also available
PROPERTIES
Items Value
CTE (DIL) *In case of Mo=20% RT - 250°C 7.4 ppm/°C
RT - 300°C 7.1 ppm/°C
Thermal conducitivity*In case of Mo=20% 25°C Z-dir. = 291W/mK
X=Y-dir. = 344 W/mK
100°C Z-dir. = 290W/mK
X=Y-dir. = 343 W/mK
Heat [kJ/(kg•K)] kJ/kgK 0.34
Specific Gravity 9.3
Hardness [Hv] Hv 120
Transverse Rapture Strength MPa 100
Tensile Strenght MPa 120
Young‘s Moduls Gpa 120
Poisson‘s Tatio 0.3
Electric Resistivity Ωm 0.0003