We provide a proprietary set of solutions based on aluminum nitride (AlN) alloys, used in production of premium UV-C LEDs, and for highly advanced thermal management applications.
Potential applications of AlON are:
- High-temperature production of AlN materials for UV-C LEDs and other electronics applications such as 5G
- Low-temperature Aluminum Oxynitride (AlON) coatings for thermal management
- TO-Packages and lead-frame based power modules
Process:
Comparison of DBC vs. AlON
Properties of high-performance coatings on Cu and Al substrates:
- Proprietary low-temperature coating process
- Low thermal impedance (0.2 oC/W, 20 mm film)
- Electrically insulating (130 V/mm)
- Thin dielectric layer (5->20 mm)
- AlON coating atomically adhered to the substrate metal
- High resistance to thermal and mechanical cycling
Conclusion
- 5-80x reduction in thermal impedance due to thin dielectric
- More heat is transferred from the chip to the environment
| Material | Thickness (mm) | Thermal Impedance(oC/W)* | Improvement vs. Al2O3 |
| NGI AlON | 0.02 | 0.2 | 80x |
| CeramicAlN | 0.63 | 3.2 | 5x |
| Al2O3 | 0.38 | 16 | 1 |