Multi-layer AMB substrates with advanced multi-layer structures are designed for high-performance electric vehicle power modules.
This cutting-edge technology enhances power efficiency and heat dissipation by integrating Cu-Block connections with Via Technology, utilizing an insulating ceramic substrate for optimal thermal and electrical performance.
Via Connection Solutions
Optimizing Electrothermal Performance with Via Technology in Insulating Ceramic Substrates
Options:
1. Via Filling Type: Metal paste (Ag, Cu).
2. Via Connection Type: Electrical conduction via active metals.
3. Cu-Block Via: Facilitates electrical conductivity in Cu-block structures.
Wireless AMB-Substrate for DSC
Si₃N₄ AMB Substrate with integrated spacer:
this technology is used for power modules with cooling on both sides, also known as “Dual-Side Cooling”(DSC).
With this construction technique, a very large heat dissipation can be realized and the reliability of SiC and GaN semiconductors will be dramatically increased.
Integrated Heat Sink on AMB Substrate
Integrated heat sink on AMB:
In order to meet the challenges of the next generation power modules with higher junction temperatures, we can offer you Si₃N₄ AMB substrates with an integrated heat sink with up to 2mm thick copper on the circuit layer.