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GlobalBA GmbH
Kemnath
Materials
DBC Substrates
AMB Substrates
DAB Substrates
DPC Substrates
Ceramic Substrates
AlON Coating
CuMoCu Heatsink
Sinter Materials
Microchannel Cooler
S-DBC Substrates
High Power MLCC
Innovations
Flying Leaded Substrates
Direct Pin-Fin Bonding
Multi-layer AMB Substrate
Via Connection Solutions
Wireless AMB-Substrate for DSC
Integrated Heat Sink on AMB Substrate
Competence
DBC-Furnace
AMB-Sputter & Brazing Line
Chemical
Patterning
Laser Processing
R&D / Engineering
Metal Processing
News
Company
Downloads
Partner
Contact
Materials
DBC Substrates
AMB Substrates
DAB Substrates
DPC Substrates
Ceramic Substrates
AlON Coating
CuMoCu Heatsink
Sinter Materials
Microchannel Cooler
S-DBC Substrates
High Power MLCC
Innovations
Flying Leaded Substrates
Direct Pin-Fin Bonding
Multi-layer AMB Substrate
Via Connection Solutions
Wireless AMB-Substrate for DSC
Integrated Heat Sink on AMB Substrate
Competence
DBC-Furnace
AMB-Sputter & Brazing Line
Chemical
Patterning
Laser Processing
R&D / Engineering
Metal Processing
News
Company
Downloads
Partner
Contact
Direct Pin-Fin Bonding
Direct Pin-Fin Bonding
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