Excellent in adhesion with thin film and thick film materials
Less variance in outline, plate thickness, slit pitch, etc.
Minimal warpage, bending, and undulation
Physical and chemical properties are stable even under a hot environment. Excellent in thermal shock resistance
High thermal conductivity and coefficient of thermal expansion similar to that of silicon
Excellent resistance against oil and chemical
Excellent in insulation properties, high dielectric breakdown voltage, high surface resistivity / volume resistivity, and smalldielectric constant
Stable breaking strength, and less variance in shape or dimensions.
The high reflective substrate, especially suitable for optical applications such as LED, is also available
ZrO2 Substrates
Well controlled surface roughness with homogeneous and fine microstructure
50% higher bending strength than Alumina or AlN substrates
20% higher thermal conductivity than alumina substrates
The optical reflectivity is higher than alumina substrates. The substrate with higher reflectivity is also available
Higher electrical insulation and smaller dielectric constant than alumina substrates
AIN Substrates
Up to 10 times greater thermal conductivity than Alumina (170-250W/mK)
Thermal expansion coefficient similar to silicon (Si)
Smaller dielectric constant and higher electric insulation
Stronger mechanical strength up to 600MPa
Superior corrosion resistance
Silicon Nitride Substrates (Si3N4)
Bending strength is about twice as high as that of aluminum nitride (AlN) and alumina
Three times higher thermal conductivity than Alumina and ZTA substrates
High dielectric breakdown voltage, high surface resistivity, high volume resistivity, excellent insulation properties
Thermal Expansion Coefficient (CTE) close to silicon
Berryllium Oxide Substrates (BeO)
Beryllium oxide substrate is the ideal material used in many high-performance semiconductor parts for applications such as radio equipment
Beryllium oxide ceramic can insulate electronic devices electrically, and at the same time remove substantial quantities of heat from them to a chassis heat sink
Some power semiconductor devices have used beryllium oxide ceramic between the silicon chip and the metal mounting base of the package in order to achieve a lower value of thermal resistance than for a similar construction made with alumina
Beryllium oxide ceramic is also used as a structural ceramic for high-performance microwave devices, vacuum tubes, magnetrons, and gas lasers
