STI
STI, a specialist in sputter, semiconductor and display equipment
STI has secured a USD 66.5M order from NTS China to build a highly automated, inline manufacturing line für high-performance AMB (Active Metal Brazed) heat-spreader substrates, used in next-generation power semiconductor devices. The line includes STI´s latest inline TiAg/TiCu sputtering and brazing technology, enabling precision metallization with significantly improved thermal performance, reliability and process efficiency.…
Manufacturer of AMB-Substrates, Sinter Paste and Sinter Foils, MLCC and Si3N4-Ceramic Substrates
A patented paste, CuB+, uses ceramic-copper composites as DCB hybrid technologies to provide enhanced electro-thermal and mechanical performance compared to standard DCB technology. By Christian Winkler and Munsoo Han, Consultants, Global BA GmbH DCB substrates with AMB performance – at DCB cost? CuB+ paste can be applied as a homogeneously-oxidized copper powder to all common…