Ag paste for Power electronics

Ag sintering paste characteristics

Ag sintering paste
Conductive filler Silver - Thermal pressure sintering
- Sintering condition
: 250°C/~5min, 5~15MPa
- High heat dissipation
- Optimized for Ag/Au surface
Ag contents (wt%) @ paste 78~87
Density 3.5~4.0
Thermal conductivity (W/mK) > 200
Shear strength (MPa) @ 5mm x 5mm > 40
Viscosity (Kcps, shear rate 10, @25°C) 28±2

Ag sintering paste for printing

Stencil Life

Image
1 2 3 4 5
6 7 8 9 10

Test method
: Printing 10 substrates after printing 300 times -> no dent / bridge

Gate pad thickness after drying

1Point 2Point 3Point
1 164 168 168
2 166 169 162
3 172 172 165
4 165 168 172
5 166 168 166
6 162 169 165
7 158 166 162
8 155 154 158
9 164 160 158
10 161 160 164

: Mask thickness 0.2mm
: Drying conditions – 130°C, 20min

Sintering _ Ag deposited AMB substrate

  • Sintering temperature: 250℃
  • Sintering time: 150 sec
  • Chip surface finish: Au
  • Chip size: 5*5mm

Sintering _ Bare AMB substrate

  • Drying conditions: 130℃, 30min, under N2
  • Sintering conditions: 280℃, 180sec, in Air
  • Chip surface finish: Au
  • Chip size: 5*5mm

After drying

After sintering