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  • Materials
    • DBC Substrates
    • AMB Substrates
    • DAB Substrates
    • DPC Substrates
    • Ceramic Substrates
    • AlON Coating
    • CuMoCu Heatsink
    • Sinter Materials
      • Ag Paste
      • Ag Film
    • Microchannel Cooler
    • S-DBC Substrates
    • High Power MLCC
  • Innovations
    • Flying Leaded Substrates
    • Direct Pin-Fin Bonding
    • Multi-layer AMB Substrate
    • Via Connection Solutions
    • Wireless AMB-Substrate for DSC
    • Integrated Heat Sink on AMB Substrate
  • Competence
    • Thermal
      • DBC-Furnace
      • AMB-Sputter & Brazing Line
    • Chemical
    • Patterning
    • Laser Processing
    • R&D / Engineering
    • Metal Processing
  • News
  • Company
    • Downloads
  • Partner
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Daily Archives: 6. February 2026

New Product Introduction – Next Generation ZTA-DBC Substrates

UncategorizedBy vschuller6. February 2026

At Global BA GmbH, we are excited to introduce a major reliability milestone in power electronics substrate technology. We are the first supplier able to provide ZTA-DBC substrates achieving thermal cycling reliability up to 1,000 cycles (1) under demanding conditions of -55°C to +150°C. Conventional ZTA-DCB solutions typically show failure mechanisms after approximately 200 cycles,…

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