STI has secured a USD 66.5M order from NTS China to build a highly automated, inline manufacturing line für high-performance AMB (Active Metal Brazed) heat-spreader substrates, used in next-generation power semiconductor devices. The line includes STI´s latest inline TiAg/TiCu sputtering and brazing technology, enabling precision metallization with significantly improved thermal performance, reliability and process efficiency.
The global demand for advanced cooling substrates continues to rise as power semiconductors operate under higher voltages and frequencies. AMB substrates play a decisive role in thermal management, lifetime, safety and inverter efficiency, and their production is becoming a strategic capability for many leading manufacturers.
STI will establish a joint venture with NTS China and implement the automated inline system starting in 2026, targeting a full-scale output of 210,000 AMB mastercard subtrates per month from 2027 onward. The new facility is expected to become a major supply hub for power semiconductor thermal components in China.
Global BA GmbH together with IPT Co., Ltd. South Korea holds the exclusive global commercialization rights for STI’s AMB & TiAg/TiCu inline sputtering and brazing equipment. Companies interested in AMB in-house production, thermal optimization or new equipment evaluation are welcome to contact us directly.
