Surface roughness plays an increasingly important role in ceramic composite materials, especially in chip sintered connections, standard surfaces of DCB and AMB substrates are often unsuitable.
Chemical surface processing cannot achieve such requirements. One possibility would be diamond processing of the copper surface.
The substrate on the left-hand side is an AlN DBC substrate featuring our standard etched surface finish, which has been widely accepted within the industry. However, some of our customers require a higher standard of quality.
As such, the substrate on the right-hand side has been given an improved surface finish. Our partner’s cutting-edge in-house from Stellar Industries, diamond machining technology enables us to achieve an exceptional surface finish of less than 0.1 microns and a flatness level of 1 micron or better.